Short-Circuit C onstraint: Between Region (0 hole(s)) Bottom Layer And Pad IC1-25(555.046mil,964.177mil) on Bottom Layer Location:
Short-Circuit C onstraint: Between Region (0 hole(s)) Bottom Layer And Pad IC1-25(555.046mil,964.177mil) on Bottom Layer Location:
从报错信息来看是底层铜皮出线了短路现象,应该是不同的网络连接在一起了,可以在报错点仔细检查下。